Metal foil tape: Relatively easy to manufacture. The use of aluminum foil and copper foil backing tape provides excellent shielding performance without expensive metal plating on the case.
Electronic equipment manufacturers usually use electromagnetic interference (EMI) and radio frequency interference (RFI) shielding measures to protect sensitive digital circuits from external radiation, and also limit the potentially harmful radiation emitted by their products.
Lead frame, as a chip carrier for integrated circuits, is a key structural component that realizes the electrical connection between the chip's internal circuit lead-out and external leads by means of bonding materials (gold wire, aluminum wire, copper wire). It plays the role of a bridge with external wires. Lead frames are required in most semiconductor integrated blocks, which is an important basic material in the electronic information industry.