Applications and types of lead frames

Your old friend Shenzhen YanMing Plate Process Co.,Ltd tells you the applications and types of lead frames.

Our Semiconductor Lead Frame is your smart choice!
As the chip carrier of the integrated circuit, the lead frame is a key structural member that realizes the electrical connection between the terminal of the internal circuit of the chip and the outer lead by means of bonding materials (gold wire, aluminum wire, copper wire) to form an electrical circuit. As a bridge to connect with external wires, lead frames are required in most semiconductor integrated blocks, which are important basic materials in the electronic information industry.
product description
There are TO, DIP, ZIP, SIP, SOP, SSOP, TSSOP, QFP (QFJ), SOD, SOT, etc. It is mainly produced by die stamping method and chemical etching method. The raw materials used in the lead frame are: KFC, C194, C7025, FeNi42, TAMAC-15, PMC-90, etc. The selection of materials is mainly based on the properties required by the product: (strength, electrical conductivity and thermal conductivity).